Semiconductor laser marking machine parameters

Applicable materials: metal and a variety of non-metallic, high hardness alloy tool steel, oxide, electroplating vacuum plating, epoxy resin, ink, ABS and other engineering plastics.

Applicable industry:

Plastic buttons, digital product parts, electronic components, electrical appliances, jewelry, precision machinery, eyeglasses and clocks, hardware accessories, automobile and motorcycle accessories, sanitary ware, communications products, medical equipment, integrated circuits (IC), building materials, pipe and other industries, More suitable for the identification of products with high precision, speed and depth requirements.

Model features:

1. Using a semiconductor side pump light source, the resonator generates a 1064 nm laser output after resonance, the electro-optical conversion efficiency is relatively high, and the beam quality is good (vs. YAG).

2. The marking speed is normal and the marking effect is fine.

3. Stable performance, less routine maintenance, affordable price.

4. No intermediate media involved in the processing makes the mark absolutely environmentally friendly and fully compliant with ROHS standards.

5. Software compatible with DXF, PLT, BMP, AI, JPG and other formats, and can automatically generate serial number, production date, barcode and two-dimensional code.

6. Optional rotary table and various automated supporting systems.

The main technical parameters:

Parameter Model KR-DP50 KR-DP75

The maximum laser power 50w 70w

Excitation source semiconductor 808nm light source (side pump)

Laser Type/Wavelength Nd:YAG∕1064nm

Beam quality <3<6

Minimum character 0.2mm 0.3mm Minimum line width 0.015mm 0.018mm

Engraving speed 250 character leap second 300 character leap second repeat accuracy ±0.002mm

Marking range 50mm×50mm～～300mm×300mm

Appearance size 800×680×1200mm

Power Requirements 220V±10%∕50Hz∕20A

Q-switch frequency 0.2-50KHz

Cooling method Cooling machine power consumption 1.5kw 2kw

Machine quality 200kg